Ten64 Networking Platform

 Our most powerful platform yet!

Community Edition launching October 2019 on Crowd Supply!

Built for 5G, uCPE, virtualization and container-based networking


Eight-Core power-efficient ARM Cortex-A53@1.6GHz


Up to 32GB DDR4 SODIMM with ECC support


independent 1000BASE-T Copper ports


SFP+ Fiber ports


5G Ready with PCIe 3.0 cellular modem support


Supports M.2 SSDs with PCIe 3.0

USB 3.0

2 x External USB 3 + 1x Internal


USB-C Serial console

2 x MiniPCIe

For WiFi and storage controllers

Dual SIM + mSD

3-choose-2 card tray

Note: Engineering Sample shown, final certified product may differ in apperance

Key features

The most advanced data plane in it’s class

Ten64 features NXP’s Second Generation Data Path Accelerator Architecture (DPAA2) which includes the 28Gbps Wire-Rate IO Processor complex (WR-IOP) with 8 Gigabit Ethernet ports + 2 x 10G SFP+, the NXP SEC accelerator engine and the Advanced IO Processor (AIOP) which can offload network processing functions from the general purpose CPU cores. With DPAA2 and IO-MMU capabilities, network ports and other hardware can be passed through to virtualized network functions (VNF’s) in a secure manner.

Ample expansion and connectivity

Ten64 features expansions slots with capabilities for solid state drives, storage controllers, xDSL modems and the ability to support the latest 5G modem cards, making it an ideal platform for uCPE, SD-WAN and fixed-wireless applications

Easy Development

Ten64 features a USB-C serial console port for easy administration and development, and uses the latest ARM Trusted Firmware and U-Boot versions. Developer boards can be booted from both microSD and QSPI Flash to make firmware development easier.

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Specifications at a Glance

Please note: Specifications below cover Revision B (Beta) developer board revision and are subject to change.


Block Diagram of board architecture
Click above for architecture diagram
  • NXP Layerscape LS1088: 8 core Cortex-A53 [64-bit ARM Architecture] @ 1.6GHz
    • Two clusters of 4 cores, 1MB ECC protected L2-cache per cluster
    • Virtualization pass-through support (IOMMU and GICv3)
    • Includes the Advanced I/O Processor (AIOP) programmable network accelerator*
  • Supports DDR4 SODIMM’s with ECC at 2100MT/s
    • non-ECC SODIMMs are supported as well. Please contact Traverse for compatibility information
    • Upwards compatible with 2400,2600 and 3200MT/s SODIMM’s

* Please note: AIOP development requires an SDK from NXP


Wired Ethernet

Eight Gigabit Ethernet (Copper)

  • 2 x VSC8514 Q[uad]SGMII Gigabit Ethernet PHYs
    • Rock-solid Vitesse/Microchip PHY Technology

Two 10G SFP+

  • Supports fiber connections and 1/N/10GBase-T through compatible SFP+ modules
  • Can be operated as 1G SFP through system settings change

All Ethernet ports are connected to the CPU directly and can be mapped dynamically using DPAA2 and IOMMU.

Wireline and Wireless

  • Supports LTE Category 6-12 and 5G cards through compatible M.2 Key B cards, USB 3.0 and PCI Express 3.0 (1 lane) supported, with 3-choose-2 Dual-SIM + microSD tray
    • Mechanical adaptors may be required for oversize (e.g 5G) cards, contact us for more information
    • Dual-SIM requires two separate SIM interfaces on the cellular module, most Cat6 and above cards support this
  • Supports Wi-Fi 5 cards through miniPCIe slots
  • Supports Traverse xDSL modem card


  • Trusted Platform Module on-board
  • NXP QorIQ SEC 5.0 engine
  • Supports ARMv8 Cryptographic extensions
  • Supports ARM TrustZone


  • Supports NVMe SSD’s in M.2 Key M slot (up to 22×80 + 22×110 in customized configuration) with two lanes of PCI Express 3.0
  • 8MB QSPI NOR flash for boot and 128MB QSPI NAND flash
  • Internal USB 3.0 port


  • USB 3.0 Type-A Ports: 2x at rear (1 direct to SoC, 1 via Hub), 1 x on board, 2A current
  • Onboard USB-Serial converter with USB-C connection
  • Expansion header: 26 pin, dual row 1.27mm pitch with 4-wire UART, system console UART, two I2C Buses, GPIOs from SoC (with interrupt) support external power and reset connections
  • Supercapacitor backed real time clock (RTC), approx. 7 days offline timekeeping


  • Bootloader: ARM Trusted Firmware + U-Boot v2019.x (upstream pending), TianoCore (planned)
  • Linux kernel: 4.19+ (some out of tree patches may be required in the short term)
  • Target specification: ARM Embedded Base Boot (EBBR)
  • Support/hardware enablement packages provided for: OpenWrt, Debian, Ubuntu, Fedora, CentOS

Power, Environment and Chassis

  • Runs from 12V DC via 8-pin connector
  • Supports ATX Power supplies, including power on/off through adaptor cable
  • Supports standard ATX power button/LED header
    • Note: power-off only supported when using ATX power supply
  • Mini-ITX Compatible, 170x175mm form factor
  • Typical power consumption: 15W (idle, no cards), 18W (with NVMe SSD + Ethernet)
  • Operating temperature (ambient): 0-85C
    • Contact us for extended temperature options
  • Cooling: SoC Heatsink required (details TBA), Case fan (airflow over SoC) recommended for standard Mini-ITX enclosures, passive cooling is possible with custom designed enclosures (TBA)
  • Sensors and Instrumentation:
    • CPU VDD/1.0V, 3.3, 5.0V, DDR VDD voltage and power consumption
    • Sensors for add in card power consumption
    • CPU Temperature sensor, Ethernet PHY temperature (x2), Board temperature sensor (near and far end)
Extra resources